Double-sided green lead-free tin-plated board, with FR-4 base material selected for the board body, and an optimized copper foil layout for efficient heat dissipation, which can quickly disperse the heat generated by components, preventing performance degradation caused by high temperatures. The edges adopt precise V-CUT board splitting design, resulting in no burrs or warping after splitting, suitable for the batch assembly requirements of small and medium-sized electronic modules. Kredsløbsledningsstabiliteten er fremragende. The core advantages focus on "high-speed production compatibility efficient heat dissipation protection environmentally friendly and durable", applicable to scenarios such as smart home control boards, industrial sensor interface boards, automotive low-voltage modules, and batch consumer electronic power modules, etc. It is a cost-effective PCB solution that balances production efficiency, usage stability, and environmental compliance.
| Materiale | FR-4, aluminiumbaseret, keramik, metal, kobberbaseret, højfrekvent, rigid-flex kombineret, halogenfri |
| Pladetykkelse | 0,3 - 6 mm |
| Kobber tykkelse | 0,5 oz - 5 oz |
| Antal lag | 1 - 32 lag |
| Oprindelse | Anhui, Kina |
| Overfladebehandling | Almindelig fortinning, blyfri fortinning, OSP, nikkel/guldbelægning, blå tape, forsølvning, fortinning |
| Minimum huldiameter | 0,25 mm |
| Minimum linjebredde | 3 mil (0,075 mm) |
| Minimum linjeafstand | 0,075 mm |
| Forholdet mellem pladetykkelse og huldiameter | 10:21 |